Teledyne LeCroy Announces New M.2/NGFF Interposer

Intel Developer Forum, San Francisco, CA, Sep 9, 2013 - Teledyne LeCroy, the worldwide leader in protocol test solutions, today announced the availability of an interposer card for analysis of M.2 Solid State Disks (SSDs) that utilize the new M.2 specification and PCI Express® (PCIe®) protocols developed by the PCI-SIG®. The M.2 Interposer Card, which is used with Summit™ Protocol Analyzers, enables PCIe bus traffic between a system board or tablet and a M.2/NGFF connector on a SSD device to be monitored, captured, and recorded for protocol analysis. The M.2 interposer will support analysis for PCIe host interfaces such as SATA Express (AHCI/PCIe) and NVM Express (NVMe) at data rates from 2.5 GT/s up to 8 GT/s, and lane widths of x2 and x4.

"Focusing on PCIe storage devices and systems testing, Teledyne LeCroy has put together a compelling solution for developers. The M.2 Interposer is not only effective in tapping high speed signals in the system but it also is flexible enough to support 22mm SSD devices providing great value for developers," said John Wiedemeier, Product Marketing Manager in the Protocol Solutions Group, Teledyne LeCroy. "This probing solution will support SATA Express devices today and will support high speed NVMe SSD devices when they become available."

"The M.2 SSD module provides a compact storage form factor for new computing systems, and can accelerate the transition to PCI Express attached SSDs," said Jim Pappas, Director of Technology Initiatives, Intel Corporation. "The M.2 interposer and PCI Express protocol analyzer from Teledyne LeCroy provides a tool for developers to test and tune M.2 SSD modules in their new platforms."

The M.2 interposer provides connectivity and monitoring capability using a PCI Express protocol analyzer for SSD devices targeted at mobile, desktop and enterprise platforms that utilize this new form factor. M.2 SSD devices come in two socket types which will be supported with two different interposer boards. One interposer will support socket 2 type devices that focus on PCIe x2 SSDs, and the other interposer will support socket 3 types that focus on PCIe x4 SSD devices. Each interposer will support 42mm x 22mm, 60mm x 22mm, 80mm x 22mm, and 110mm x 22mm SSD sizes. To use the interposer, the SSD device is inserted into the interposer and a M.2 connector probe board that extends the PCIe signal path is inserted into the host M.2 slot. The interposer taps all PCIe protocol traffic between the host and the SSD device, and records it using the Summit Protocol Analyzer, where protocol issues and performance metrics can be analyzed and debugged.

"The new M.2 form factor specification is essential for developing power-efficient, high-performance tablets, thin and light laptops and other devices targeted for consumer and enterprise markets," said Al Yanes, PCI-SIG Chairman and President. "We are pleased that Teledyne LeCroy continues to support the PCI-SIG by developing probing solutions for form factors such as those based on the M.2 connector."

Three years ago, Teledyne LeCroy was the first company to introduce a PCI Express protocol analyzer supporting NVM Express (NVMe), the new PCI Express storage decoding standard. Since that time Teledyne LeCroy has added decoding for both SCSI Express (SOP/PQI) and SATA Express (AHCI/PCIe), and also specific probing for SFF-8639 connector-based storage system and devices. Integrating all three PCIe SSD technologies into a single protocol analyzer and adding targeted storage probing solutions gives developers versatile tools that can show essential details regarding proper data transmission and bus performance. These tools have been critical for much of the PCIe SSD interoperability testing that has occurred over the last few years.

The M.2 Interposer is available to order now. For additional information, contact Teledyne LeCroy at 1-800-5LeCroy (1-800-553-2769) or visit Teledyne LeCroy's web site at teledynelecroy.com.

Teledyne LeCroy is a worldwide leader in serial data test solutions, creating advanced instruments that drive product innovation by quickly measuring, analyzing and verifying complex electronic signals. The Company offers high-performance oscilloscopes, signal integrity test solutions and global communications protocol analyzers used by design engineers in the computer, semiconductor and consumer electronics, data storage, automotive and industrial, telecommunications, and military and aerospace markets. Teledyne LeCroy's 49-year heritage of technical innovation is the foundation for its recognized leadership in "WaveShape Analysis" - capturing, viewing and measuring the high-speed signals that drive today's information and communications technologies. Teledyne LeCroy is headquartered in Chestnut Ridge, New York. Company information is available at teledynelecroy.com.

PCI-SIG is the consortium that owns and manages PCI specifications as open industry standards. The organization defines industry standard I/O (input/output) specifications consistent with the needs of its members. Currently, PCI-SIG is comprised of nearly 800 industry-leading member companies. To join PCI-SIG, and for a list of the Board of Directors, visit www.pcisig.com.

© 2013 by Teledyne LeCroy All rights reserved. Specifications are subject to change without notice.

PCI-SIG, PCI Express and PCIe are trademarks or registered trademarks of PCI-SIG.