PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, MIPI M-PHY, and 100-GHz Oscilloscope Capabilities to be Showcased at DesignCon 2016

Chestnut Ridge, NY and Santa Clara, CA, January 20, 2016 – Teledyne LeCroy, a longtime Diamond Sponsor of DesignCon, will once again be showcasing the latest innovations in test technology on the exhibition floor in Santa Clara, January 20-21. Product exhibits include the world's first and only 100 GHz bandwidth real-time oscilloscope; the HDO family of 12-bit high definition oscilloscopes; PAM4 signal analysis; USB 3.1 and Power Delivery compliance test; MIPI M-PHY physical- and protocol-layer test; PCI Express Tx/Rx compliance with the only receiver/transmitter test instrument certified for PCIe link equalization testing; and DDR compliance and debug capabilities.

The LabMaster 10-100Zi-A 100 GHz oscilloscope demonstrates a long running commitment by Teledyne LeCroy to leadership in the high-end oscilloscope market, aggressively pushing real-time bandwidth and sample-rate boundaries to achieve 100 GHz and 240 GS/s, respectively.

DesignCon attendees have the opportunity to interact with Teledyne LeCroy design engineers and technical experts in a variety of venues. A series of ten 15-minute talks will be presented in booth 735 over two days of the exposition. Topics relate to the instrument and application demonstrations, and in addition include engineering lessons by signal integrity expert Dr. Eric Bogatin at 1 PM on both days. A complete schedule of speakers and topics can be found at teledynelecroy.com/designcon.

Other significant contributions to the technical conference include "PAM4: New Measurement Science for New Signal Technologies" presented in the Chiphead Theater on the expo floor on Thursday at 1 PM by Dr. Martin Miller and Dr. Patrick Connally. Dr. Miller is scheduled to participate on a panel with industry jitter experts on Tuesday, while Stephen Mueller joins a Thursday panel session titled, "PAM4: New Measurements are Coming."

DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: http://www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

Teledyne LeCroy is a leading manufacturer of advanced test instruments that measure, analyze, and verify complex electronic signals. The Company offers high-performance oscilloscopes and protocol test solutions used by electronic design engineers in a wide range of application and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy’s website at teledynelecroy.com.

© 2016 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.