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Teledyne LeCroy's High-speed Digital Analyzer and Probing System Complete Mixed-Signal Solution

HDA125 High-speed Digital Analyzer adds 18-channel, 12.5-GS/s digital acquisition capabilities with industry-leading sensitivity and revolutionary QuickLink probing solution to Teledyne LeCroy oscilloscopes

Chestnut Ridge, NY, and Santa Clara, CA, January 20, 2016 – Teledyne LeCroy today significantly expands the capabilities of its industry-leading oscilloscopes with the introduction of the HDA125 High-speed Digital Analyzer. The HDA125 digital acquisition system captures 18 channels of digital data at 12.5 GS/s. Adding it to Teledyne LeCroy oscilloscopes by means of the LBUS interface architecture results in the most flexible, highest-performance mixed-signal solution available. Also announced today is the QuickLink probing system, featuring low-cost, high-fidelity probe tips that work with both the HDA125 and Teledyne LeCroy WaveLink probes using the new Dxx30-QL QuickLink adapter.

HDA125 High-speed Digital Analyzer

The HDA125 samples 18 input signals at 80 ps intervals (12.5 GS/s) for accurate characterization of the fastest signals. However, sample rate is only half the storyhigh-speed embedded systems testing often poses challenging signal amplitude conditions. The High-speed Digital Analyzer meets these challenges with a 3-GHz digital leadset, ultra-low probe loading, and industry-leading sensitivity (150 mV minimum signal swing). The system ensures the most precise digital signal interpretation with a unique hysteresis adjustment capability, and three times better threshold accuracy than competing mixed-signal instruments.

QuickLink Probing System

The QuickLink probe tip system is designed from the ground up to be compatible with both the HDA125 High-speed Digital Analyzer and with Teledyne LeCroy's WaveLink series of differential analog probes. This cross-connection capability allows a device under test (DUT) to be equipped with QuickLink Solder-In (QL-SI) tips at all desired test points, enabling swapping of connections between digital and analog acquisition systems as needed.

Unlike other "consumable" probe tip solutions that rely on tiny, delicate tips located very close to the DUT, the QL-SI tip has an integral 9-inch lead. When connected to a WaveLink analog probe using the new Dxx30-QL adapter, QuickLink tips provide 6 GHz of bandwidth and a flat, well-controlled frequency response. Used for digital acquisitions with the HDA125, they support 3 GHz bandwidth with industry-leading sensitivity. In both cases, high input impedance (110 kΩ, 0.12pF differential) ensures minimal loading of the DUT.

Enhanced DDR Validation and Debug Capability

Teledyne LeCroy already offers the industry's only dedicated DDR Debug Toolkit, designed to simplify challenging memory interface validation. Adding the HDA125 allows the DDR command bus to be directly acquired and integrated into the analysis, enabling advanced command triggering and sophisticated, searchable bus state viewing. This is complemented by the intrinsic flexibility and performance of the QuickLink probing system, which allows easy transitions between digital and analog acquisitions of the signals under test.

Find more information on Teledyne LeCroy's industry-leading DDR test solutions at http://teledynelecroy.com/ddr/.

Pricing and Availability

The HDA125 is available in two models. The HDA125-18-LBUS is supplied with a full 18-channel leadset (including 18 QL-SI probe tips), and is priced at $20,900. For applications requiring fewer channels, the HDA125-09-LBUS is supplied with a 9-channel leadset (including 9 QL-SI probe tips), and is priced at $17,900. The HDA125 will initially be compatible with WaveMaster, SDA, and DDA 8Zi series oscilloscopes; compatibility with other instruments will follow.

The Dxx30-QL connects QL-SI probe tips to Dxx30 8-13 GHz WaveLink differential probe series and is priced at $850. A QuickLink "starter pack," the Dxx30-QL-3SI, is priced at $1390 and consists of one Dxx30-QL adapter and three QL-SI tips. Support for the QL-SI tip on 4-6 GHz WaveLink differential probes will be added in the spring of 2016.

Delivery time on the above products is approximately 8-10 weeks ARO.

About DesignCon

DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: http://www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

About Teledyne LeCroy

Teledyne LeCroy is a leading manufacturer of advanced test instruments that measure, analyze, and verify complex electronic signals. The Company offers high-performance oscilloscopes and protocol test solutions used by electronic design engineers in a wide range of application and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com.

© 2016 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.

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Customer contact:
Hilary Lustig, Marketing Communications Manager
Patrick Connally, Product Manager
Teledyne LeCroy Customer Care Center
(845) 425-2000
(845) 425-2000
(800) 553-2769