Technical Library

Technical Library

The Conference Proceedings section of the Teledyne LeCroy Technical Library lets you search for, browse, and print the latest technical documentation. A search aid allows you to filter documents by category or keyword.

Conference Proceedings on this site are available in PDF format for easy download.

Conference Proceedings

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DesignCon 2017 - Understanding Vertical Resolution in Oscilloscopes

This paper discusses analog-to-digital converter (ADC) resolution (mostly with regard to oscilloscopes) and considerations for improving resolution using various ADC deployment methods.

DesignCon 2017 - The Fastest PAM4 Signal Ever Generated

The fastest electrical PAM-4 signal is demonstrated. The technology behind the generation of this signal along with the acquisition of the signal is discussed along with the motivation for generating signals like this in optical communications research.

DesignCon 2017 - A Generic Test Tool For Power Distribution Networks

Power distribution network testing and validation is an important task in the system design flow. To avoid unnecessary testing time, the measurement setup, the instruments and the connections should be reusable for different tasks. Instruments and setups, therefore, whether they work in the time domain or frequency domain, limit the number of functions that can be performed without changing instruments, or cables or connections. The paper explores test setups and instrumentations that allow multiple tests being performed without changing the hardware connections. Real-life test results will illustrate the benefits and limitations of the setup.

Practical Considerations in Measuring Power and Efficiency - APEC2016 Industry Session

Practical Considerations in Measuring Power and Efficiency on PWM and Distorted Waveforms during Dynamic Operating Conditions

DesignCon 2011 - Unified Methodology of 3D-EM/Channel Simulation/Robust Jitter Decomposition

Developing Unified Methods of 3D Electromagnetic Extraction, System Level Channel Modeling, and Robust Jitter Decomposition in Crosstalk Stressed 10Gbpsec Serial Data Systems

DesignCon 2014 - Jitter Noise Duality

We compare two approaches where the structure of the eye diagram is considered either as a timing uncertainty or alternatively a vertical uncertainty. We show that only the second view allows accurate BER evaluation, even if the eye is closed. It follows from BER definition that its proper evaluation should be based on considering the two portions of the eye diagram, and by their separate integration. With such understanding of BER, it turns out that the jitter-induced vertical noise can be considered same way as the signal’s ISI, although correlated with the latter.

Practical Techniques and Tips for Probing and De-Embedding

Getting a clean signal to your oscilloscope has become a complicated business. How much does probe loading matter? What is the effect of the probe's calibration? Are there reflections to worry about? If you're de-embedding, how do you separate de-embedding problems from signal problems? In this session, practical examples are used to show how these considerations affect high-speed measurements, and how to apply knowledge about the tools at hand to ensure the best results.

DesignCon 2014 - Have your cake and eat it, too: Engineering measurements at fabrication for channel design and process control

This paper demonstrates the acquisition of advanced circuit board performance parameters from breakaway test coupons measured right at the PCB fabricator. We show how to acquire S-parameter and TDR-based measurements up to 30 GHz using robust probes and test coupon fixtures. The measurements provide pass/fail tests for process control and they provide model parameters as feedback to improve channel design. By way of example, we demonstrate measurements of several representative test coupons, perform total loss tests, such as SET2DIL, and extract design parameters that can be used to improve EDA channel models.

DesignCon 2014 - Computation of Time Domain Impedance Profile from S-Parameters: Challenges and Methods

When computing time-domain impedance profile from measured S-parameters, we face two types of problems. First is caused by low quality of sampled S-parameters, such as insufficient resolution, band-limiting, noise etc. These limitations create certain numerical challenges, such as response aliasing, ringing and noncausality. The computed impedance becomes sensitive to termination conditions set up at the far end of the connector.