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Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy Honored with DesignCon 2016 Engineer of the Year Award

Award Recognizes Individuals Showing Leadership, Creativity, and Out-of-the-Box Thinking

Santa Clara, CA, January 21, 2016 – Teledyne LeCroy today announced that the Dean of the Teledyne LeCroy Signal Integrity Academy, Dr. Eric Bogatin, has been awarded the DesignCon 2016 Engineer of the Year Award. The awards recognize professionals who have exuded leadership, creativity, and out-of-the-box thinking in regards to design/test of chips, boards, or systems. The award, sponsored by National Instruments, was presented earlier today at DesignCon 2016, which is being held January 19-21, at the Santa Clara Convention Center.

"I am thrilled and honored to be selected as Engineer of the Year. The nomination itself, and making the finalist list, was a thrill. I feel honored to be in the company of some of the industry experts like Istvan Novak, Bob Shaefer, and the late Steve Weir. I've learned most of what I know from these experts. It must have been all the chocolates I threw to engineers taking my classes that influenced them to vote for me," says Bogatin.

"It is very fitting that Eric was selected as this year's DesignCon Engineer of the Year, since he was present at the very first DesignCon over twenty years ago," said DesignCon Technical Program Director, Janine Love. "Eric epitomizes the spirit of DesignCon in that he is committed to teaching others about what he has learned and is always willing to answer questions and help the DesignCon community."

Dr. Bogatin was carefully selected as a finalist by the editors of EDN/EETimes and chosen as the winner of the award based on online voting from the DesignCon community. He was honored during the awards ceremony, held January 21, and awarded with a $10,000 grant or scholarship to the educational institution of his choice.

For more information on DesignCon 2016 Engineer of the Year Award, please visit: designcon.com/santaclara/awards/

About DesignCon

DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: http://www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

About Teledyne LeCroy

Teledyne LeCroy is a leading manufacturer of advanced test instruments that measure, analyze, and verify complex electronic signals. The Company offers high-performance oscilloscopes and protocol test solutions used by electronic design engineers in a wide range of application and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com.

© 2016 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.

Media contact:
Hilary Lustig, Marketing Communications Manager
(845) 578-6120