90 Degree PCIe 3.0 Right Server Interposer Card
The 90 Degree PCIe 3.0 Server Interposer is a specialty probe that makes it possible to analyze data traffic between an IO card in a server system board inside of a 1U/2U rackmount chassis . To use the 90 Degree PCIe 3.0 Server Interposer, simply plug the IO card you want to test into the interposer, then plug the interposer into the riser card in the 1U/2U Rackmount host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
90 Degree PCIe 3.0 Left Server Interposer Card
The 90 Degree PCIe 3.0 Server Interposer is a specialty probe that makes it possible to analyze data traffic between an IO card in a server system board inside of a 1U/2U rackmount chassis . To use the 90 Degree PCIe 3.0 Server Interposer, simply plug the IO card you want to test into the interposer, then plug the interposer into the riser card in the 1U/2U Rackmount host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
Active Interposer Card for PCIe 2.0
The Gen2 x8 and x16 Active Interposers support data rates of 2.5 GT/s (Gen1) and 5.0 GT/s (Gen2), and lane widths up to x16 ( for the x8 interposers, the PCIe connector on the card will support PCIe expansion cards up to x16, but the lane width will be negotiated down to a maximum of x8 when passing through the interposer card). The interposers can be used with host PCIe expansion slots as small as x1 by using card edge reducer adapters.
The Gen2 x16 Active Interposer is for use with the Summit T3-16 Analyzer (or with two Summit T3-8 Analyzers). The Gen2 x8 Active Interposer is for use with the Summit T3-16, the Summit T3-8 and the Summit T28. The Gen2 x8 Active Interposer is also available in a version which supports CLKREQ# and SRIS for testing low power modes supported by these features.
Active Interposer Card for PCIe 3.0
The Gen3 x1, x4, x8 and x16 Interposers support data rates of 2.5 GT/s (Gen1),5.0 GT/s (Gen2),and 8.0 GT/S(Gen3). The Gen3 x16 Interposer is for use with the Summit T3-16 Analyzer (or with two Summit T3-8 Analyzers). The Gen3 x1/x4/x8 Interposers are for use with the Summit T3-16 and the Summit T3-8. The Gen3 Interposers are available with support for CLKREQ# and SRIS for testing of low power modes supported by these features (see datasheet below). For customers that do not require these features, the interposers are also available in configurations without support for CLKREQ# and SRIS (but otherwise identical in size and appearance) at a lower cost.
AMC Mezzanine Card Interposer for PCIe 2.0
The AMC Mezzanine Card Interposer for PCIe 2.0 is a specialty probe that makes it possible to analyze data traffic from an Advanced Mezzanine Card (AMC) that uses a PCI Express interface to connect to the carrier board system. To use the AMC Interposer, simply plug the AMC card you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
CompactPCI Serial Interposer
Teledyne LeCroy's CompactPCI Serial Interposer provides a dedicated probe that makes it easier to analyze in-band PCI Express data traffic between a CompactPCI Serial card and its system. The interposer assures reliable data transmission while providing 100% capture of all PCIe® data traffic flowing through the CompactPCI Serial interface. The CompactPCI Serial Interposer supports data rates of 2.5 GT/s (Gen1) and 5.0 GT/s (Gen2), and lane widths up to x8.
Dish Interface Board for Gen3 Mid-bus Probe
The Teledyne LeCroy PCIe 3.0 x8 Dish interface platform provides a new way for developers to attach a protocol analyzer to probe PCI Express buses during the prototype stage of board development. The dish board is a 5" (12.7 cm) diameter board constructed with Rogers 4350 low-loss dielectric, with 62 pairs of high-speed SMP connectors for signal attachment, and a full-size PCIe Mid-bus probe footprint in the center of the board.
The Teledyne LeCroy dish board provides a means for developers to introduce a mid-bus footprint in an easy, flexible and mechanically stable design. The board design provides a practical means of easily connecting a mid-bus probe to the footprint integrated into the center of the platform during early prototype development and test of new PCIe 2.0 and 3.0 designs. The board can be mechanically fixed to the DUT through the use of 2 or more of the six provided mounting holes for standoffs. The size of the standoffs can be varied to accommodate component heights on the DUT board.
Connections from the dish to the DUT are made using the high-speed SMP connectors mounted on the dish board, which allow connection to test points on the DUT using standard coaxial cables. This allows far more flexibility in connecting signals from different locations on the DUT board, or even from multiple boards and backplanes. Some examples of the flexibility provided by the dish board include connecting an analyzer in a simple chip-to-chip serial interconnect test environment (as shown below), connecting an add-in card via a standard PCIe slot, and connecting a cable or backplane assembly to test signal transmission in real application environments.
Note: The Dish Interface can be used to test Gen1, Gen2 or Gen3 PCI Express buses. However, the probe footprint incorporated into the board is the Gen3 footprint, so a Gen3 Mid-bus probe should be used to attach a protocol analyzer to the Dish Interface regardless of the data rate of the bus under test.
Key Features
- Easily Probe PCIe® Buses
- The dish board allows easy probing of PCI Express buses during prototype and early development of PCIe 2.0 and 3.0 designs
- Stable Mounting Platform
- The dish board provides a convenient and stable way to introduce a mid-bus probe footprint into a test setup
- More Flexible Attachment
- The dish board allows reliable connections to PCIe buses across multiple test boards
- Optimized Signal Integrity
- The dish board design uses Rogers 4350 to maintain optimum signal integrity across all lanes
- Supports x8 Lane Widths
- One dish supports x1, x2, x4 and x8 designs. Add a second for x16.
- Supports PCIe 3.0 Data Rates
- Supports 2.5, 5 and 8 GT/s
ExpressCard Interposer
The ExpressCard Interposer is a specialty probe that makes it possible to analyze data traffic from a PCMCIA ExpressCard that uses a PCI Express interface to connect to a host system. To use the ExpressCard Interposer, simply plug the ExpressCard you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
ExpressModule Interposer
The ExpressModule Interposer is a specialty probe that makes it possible to analyze data traffic from an ExpressModule to a host system. To use the ExpressModule Interposer, simply plug the ExpressModule you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
External Cable Interposer
The Teledyne LeCroy External Cable Interposer makes it easy to capture and analyze data traffic between a host and device that are connected using an external PCI Express cable by tapping into the external cable connection. The interposer is easily connected by connecting cables from the host and devices, and the interposer then provides a connection to allow an analyzer to capture and decode data traffic between the two systems. The External Cable Interposer supports PCI Express data channels with lane widths of x4 and x8 at all standard PCIe data rates up to 5 GT/s.
Gen 3 U.2 Standard Interposer
The Standard Port 5-Inch or 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector. The interposer allows x4 NVM Express, x4SCSI Express or x2 SATA Express host interface based SSD traffic to be monitored, captured and recorded. The Interposer supports SRIS, CLCKREQ# and SMBus.
Gen 3 U.2 Dual Port Interposer
The Dual Port -inch or 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector. The interposer when used with a dual PCI Express protocol analyzer setup allows traffic from dual port NVM Express and SCSI Express SSD drives to be monitored, captured and recorded from each port simultaneously. The Interposer supports SRIS, CLCKREQ# and SMBus.
HP Blade Server Interposer
The HP Blade Server Interposer is a specialty probe that makes it possible to analyze data traffic from a blade server designed for an HP BladeSystem to the host system. To use the HP Blade Server Interposer, simply plug the blade server you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
M.2 Adapter
Teledyne LeCroy’s M.2-to-PCIe adapter cards provide developers with extremely versatile tools to speed development of new M.2 designs and to troubleshoot existing M.2 issues. Two configurations are offered to support either M-Key or B-Key (both support B-M).SMBus is supported on the adapter.
Mid-bus Probe
Mini Card Interposer
The Mini Card Interposer is a specialty probe that makes it possible to analyze data traffic from a Mini Card that uses a PCI Express interface to connect to a host system. To use the Mini Card Interposer, simply plug the Mini Card you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
Multi-lead Probe
The Multi-lead Probe is a specialty probe that makes it possible to analyze PCI Express serial data traffic in an embedded data bus (e.g.., a PCI Express bus that runs between components on the same PCB). As long as the traces are exposed on the surface of the PCB, the Multi-lead Probe allows for attachment to isolation resistors soldered to the bus traces, and provides a data capture path for a Teledyne LeCroy PCI Express protocol analyzer. This eliminates the need to design any special purpose footprints or connectors into the board.
Passive Interposer for Gen2
The new Teledyne LeCroy Gen2 Passive Interposer provides an economical means to probe PCI Express traffic between a host and PCIe® expansion card. The interposer assures reliable data transmission while providing 100% capture of all data traffic flowing through the PCIe slot interface. Connecting the interposer to a Teledyne LeCroy analyzer allows decoding and display of data flowing in both directions and across all lanes, and will display data traffic using the industry-standard CATC Trace™ data display, along with a wide range of traffic and error reports. The Gen2 Passive Interposer supports data rates of 2.5 GT/s (Gen1) and 5.0 GT/s (Gen2), and lane widths up to x16.
PCIe 3.0 M.2 Interposer
The M.2 interposer provides connectivity and monitoring capability for M.2 connector based SSD memory modules targeted at thin client devices such as tablets. The interposer supports 42mm x 22mm, 60mm x 22mm, 80mm x 22mm , and 110mm x 22mm SSD lengths.
PCI Express Gen3 M.2 Interposer
The M.2 interposer provides connectivity and monitoring capability for M.2 connector based SSD memory modules targeted at thin client devices such as tablets. The interposer supports 30mm x 22mm, 42mm x 22mm, 60mm x 22mm, 80mm x 22mm , and 110mm x 22mm SSD lengths.
PCIe External Cable 3.0 Interposer
The PCIe External Cable 3.0 Interposer provide connectivity and monitoring capability for PCI Express External Cabling Specification Revision 3.0 based cables. This cable type is defined in the PCI Express External Cabling Specification Revision 3.0, developed by the PCI-SIG®. One cable can support link widths from x1 to x4. Larger links can be achieved by adding additional cables. For example, a x8 link uses two cables.
Single Port 5-inch PCIe 3.0 U.2 (SFF-8639) Interposer
The Single Port 5-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector.
The interposer allows x4 NVM Express, x4SCSI Express or x2 SATA Express host interface based SSD traffic to be monitored, captured and recorded.
Single Port 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer
The Single Port 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector. The interposer allows x4 NVM Express, x4SCSI Express or x2 SATA Express host interface based SSD traffic to be monitored, captured and recorded.
Dual Port 5-inch PCIe 3.0 U.2 (SFF-8639) Interposer
The Dual Port 5-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector. The interposer when used with a dual PCI Express protocol analyzer setup allows traffic from dual port NVM Express and SCSI Express SSD drives to be monitored, captured and recorded from each port simultaneously.
Dual Port 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer
The Dual Port 12-inch PCIe 3.0 U.2 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2 (SFF-8639) connector. The interposer when used with a dual PCI Express protocol analyzer setup allows traffic from dual port NVM Express and SCSI Express SSD drives to be monitored, captured and recorded from each port simultaneously.
Summit Z3-16 Test Platform
The Summit Z3-16 Test Platform allows the Summit Z3-16 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen3, Gen2 or Gen1 hosts and devices.
VPX Interposer
The Teledyne LeCroy Specialty Interposer Card for VPX Applications supports VPX developers by providing a quick and easy way to connect a Teledyne LeCroy protocol analyzer to the PCI Express data channels in the VPX interface. The protocol analyzer can then capture, decode and display all PCI Express data traffic between the VPX expansion card and the VPX backplane. The VPX Interposer Card supports PCI Express data channels with lane widths up to x8, at PCIe® 2.0 (Gen2) data rates up to 5 GT/s.
XMC Mezzanine Card Interposer
XMC Mezzanine Card Interposers
The XMC Mezzanine Card Interposers are specialty probes that make it possible to analyze data traffic from a VITA 42.3 Switched Mezzanine Card (XMC) that uses a PCI Express interface to connect to the carrier board system. To use an XMC Interposer, simply plug the XMC card you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
There are two versions of the XMC Interposer supplied by Teledyne LeCroy: (a) a Gen1 (2.5 GT/s) version primarily intended for use with the PETracer ML Analyzer (but compatible with the Summit T2-16 and Summit T3-16 Analyzers), and (b) a Gen2 (supporting 2.5 GT/s and 5 GT/s) intended for use with the Summit T2-16 or Summit T3-16 Analyzers.
| | Part Number | PETracer ML | Summit T2-16 | Summit T3-16 |
| Gen1 XMC | PE036UIA-X |  * | | |
| Gen2 XMC | PE048UIA-X | | * | * |
*Recommended for new systems